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Ovi
10th March 2000, 11:41
Hello everyone
I have a question-I have read that the new lot of G200's are being manufactured by the .25 micron process while the earlier generation was being manufactured by the .35 micron process. So is it true that these newer chips do not require any heatsink? My Millenium G200 LE that I bought recently doesn't have one. So is this coz it doesn't need it or is it being done to save costs?
Thanks
Ovi

Kruzin
10th March 2000, 11:46
Correct, the later G200/G250s are on a .25u die, and are shipped without a heat sink. It should be fine, as long as your case if properly ventilated, and you are not overclocking the card. If you are going to o/c, or if there are heat concerns, you can easily install an aftermarket cooler (like the Tennmax Lasagne)...

Alec
10th March 2000, 11:46
Most probably because it doesn´t need one.
Does it come with the sticker on the chip?

Ovi
10th March 2000, 11:59
There was no sticker on the chip,just the usual information(which I didn't read!)printed on the chip.But what is the sticker supposed to be for?But thanks a lot for clearing up my doubts(and soo fast http://forums.murc.ws/ubb/smile.gif)
Cheers
Ovi

[This message has been edited by Ovi (edited 10 March 2000).]

[This message has been edited by Ovi (edited 10 March 2000).]